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TS EN 60749-11 Semiconductor devices - Mechanical and air conditioning test methods - Part 11: Rapid temperature change - Dual liquid bath method
TS EN 60749-12 Semiconductor devices-Mechanical and air conditioning tests-Part 12: Vibration, variable frequency
TS EN 60749-13 Semiconductor devices-Mechanical and air conditioning tests and methods-Part 13: Saline atmosphere
TS EN 60749-2 Semiconductor devices - Mechanical and air conditioning tests - Part 2: Low air pressure
TS EN 60749-3 Semiconductor devices - Air conditioning and mechanical test method - Part 3: External visual inspection
TS EN 60749-4 Semiconductor devices - Mechanical and air conditioning test methods - Part 4: Wet temperature steady state, highly accelerated strain test (hast)
TS EN 60749-6 Semiconductor devices - Mechanical and air conditioning test methods - Part 6: Storage at high temperatures
TS EN 60749-9 Semiconductor devices - Mechanical and air conditioning test methods - Part 9: Persistence of marking
TS EN 60749-1 Semiconductor circuits - Mechanical and climate test methods - Section 1: General
TS EN 60749-5 Semiconductor circuits - Mechanical and climate test methods - Part 5: Continuous state temperature humidity slope (bias) life test
TS EN 60749-8 Semiconductor circuits - Mechanical and climatic test methods - Section 8: Sealing
TS EN 60749-16 "semiconductor devices - Mechanical and climatic test methods - part 16: Particle impact noise detection (PIND)"
TS EN 60749-17 Semiconductor circuits - Mechanical and climate test methods - Section 17: Neutron radiation
TS EN 60749-18 Semiconductor circuits - Mechanical and climate test methods - Section 18: Ionizing radiation (total dose)
TS EN 60749-19 Semiconductor circuits - Mechanical and climatic test methods - Section 19: Die shear intensity
TS EN 60749-22 Semiconductor circuits - Mechanical and climate test methods - Part 22: Bond strength
TS EN 60749-31 Semiconductor circuits - Mechanical and climate test methods - Section 31: Flammability of plastic encapsulated circuits
TS EN 60749-32 Semiconductor circuits - Mechanical and climate test methods - Section 31: Flammability of plastic encapsulated circuits
TS EN 60749-36 Semiconductor circuits - Mechanical and climatic test methods - Section 36: Acceleration, steady state
TS EN 60749-14 Semiconductor circuits - Mechanical and climatic test methods - Section 14: Robustness of terminations lead integrity
TS EN 60749-23 Semiconductor circuits - Mechanical and climate test methods - Section 23: High temperature operating life
TS EN 60749-24 Semiconductor circuits - Mechanical and climate test methods - Section 24: Accelerated moisture resistance, unbiased (ill)
TS EN 60749-25 Semiconductor circuits - Mechanical and climatic test methods - Part 25: Temperature cycle
TS EN 60749-30 Semiconductor circuits - Mechanical and climatic test methods - Section 30: Pre-conditioning of non-hermetic surface-mounted circuits before reliability testing
TS EN 62007-2 Semiconductor optoelectronic devices for fiber optic system applications - Part 2: Measurement methods
TS EN 60749-20 Semiconductor elements - Mechanical and climatic test methods - Section 20: Resistance of plastic encapsulated smd to the combined effect of moisture and soldering heat
TS EN 60749-19 / A1 Semiconductor components - Mechanical and climatic test methods - Part 19: Chip breaking strength
TS EN 62418 Semiconductor devices - Test of tension of metal properties
TS EN 62374-1 Semiconductor devices - Part 1: Time-dependent dielectric breakage for door dielectric films (tddb)
TS EN 60749-30 / A1 Semiconductor components - Mechanical and climatic test methods - Part 30: Preconditioning of non-sealed surface-mounted components prior to reliability testing
TS EN 62047-8 Semiconductor circuits - Micro electromechanical devices - Part 8: Strip bending test method for measuring the elongation property of thin films
TS EN 60749-21 Semiconductor components - Mechanical and climatic test methods - Part 21: Solderability
TS EN 60749-29 Semiconductor elements - Mechanical and climatic test methods - Part 29: Lockout test
TS EN 62047-5 Semiconductor circuits - Micro-electromechanical devices - Part 5: RF MEMS switches
TS EN 62047-7 Semiconductor circuits - Micro electromechanical devices - Part 7: Radio frequency control and mems baw filter for selection
TS EN 62047-9 Semiconductor circuits - Micro-electromechanical devices - Part 9: Measurement of plate-to-plate bond strength for Mems
TS EN 60749-40 Semiconductor devices - Mechanical and air conditioning test methods - Part 40: Test method of plate boundary drop using stain device
TS EN 62047-10 Semiconductor circuits - Microelectromechanical devices - Part 10: Measurement of elongation property of thin films for Mems materials
TS EN 62047-12 Semiconductor circuits - Micro electromechanical devices - Part 12: Bending fatigue test methods of thin film materials using resonance vibration of Mems structures
TS EN 60749-34 Semiconductor components - Mechanical and climatic test methods - Part 34: Power cycling
tst ISO / IEC 10373-2 Identification cards - Test methods - Part 2: Magnetic stripe cards
TS EN 60749-27 / A1 Semiconductor devices - Mechanical and climate test methods - Part 27: Electrostatic discharge (esd) sensitivity test - Machine model (mm)
TS EN 60191-6-22 Mechanical standardization of semiconductor elements - Part 6-22: General rules for the preparation of outline drawings of surface-mounted semiconductor element packages -Silicon Thin-step Top Grid Array and Silicon Thin-step Islet Grid Array Design for Silicon Thin Step Islet Grid Array Semiconductor Packages manual (S-FBGA and S-FLGA)
TS EN 60747-5-5 Individual semiconductor devices and integrated circuits-Part 5-3: Optoelectronic devices-Photocouplers
TS EN 60191-3 Mechanical standardization of semiconductor elements - part 3: General rules for the preparation of outline drawings of integrated circuits
TS EN 60749-26 Semiconductor components - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity tests - Human body model (HBM)
TS EN 60749-42 Semiconductor elements - Mechanical and climate test methods - Part 42: Temperature and humidity test chambers
TS EN 62779-2 Semiconductor devices - Semiconductor interfaces for human body communication - Part 2: Characterization of interface performances
TS EN 62779-1 Semiconductor devices - Semiconductor interfaces for human body communication - Part 1: General rules
TS EN 62779-3 Semiconductor devices - Semiconductor interfaces for human body communication - Part 3: Functional type and operating conditions
TS EN 60749-44 Semiconductor elements - Mechanical and climatic test methods - Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
TS EN 60191-6-13 Mechanical standardization of semiconductor devices - Part 6-13: Design guide for regular spaced grid arrangement (FLGA) and grid arrangement of fine holes (FBGA) (FBGA / FLGA)
TS EN 60191-1 Mechanical standardization of semiconductor elements - Part 1: General rules for the preparation of outline drawings of discrete elements
TS EN 60191-6 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface-mounted semiconductor circuit packages
TS EN 60191-6-20: Mechanical standardization of semiconductor devices - Part 2010-6: General rules for the preparation of sketches of packages for surface-mounted semiconductor devices - Measurement methods for the dimensions of small draft j-pin packages (ktj)
TS EN 60191-6-17: 2011 Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of draft drawings of packages for surface-mounted semiconductor design guidelines for stacked packages - Design guide for regular spacing and regular spacing grid layout ppfbga and p-Pflga)
TS EN 60191-6-16 Mechanical standardization of semiconductor elements - Part 6-16: Glossary of practice sockets and semiconductor tests for bga, lga, fbga and flga
TS EN 60191-6-18 Mechanical standardization of semiconductor devices - Part 6-18: General rules for preparing outline drawings of the surface mount of semiconductor device packages - Design guide for the round grid array
TS EN 60749-4 Semiconductor devices - mechanical and air conditioning test methods - Part 4: Wet temperature, steady state, highly accelerated forcing test (yhzd)
TS EN 60749-6 Semiconductor devices - mechanical and air conditioning test methods - Part 6: High temperature storage
TS EN 60749-1 Semiconductor components - Mechanical and climatic test methods - part 1: General
TS EN 60749-5 Semiconductor elements - Mechanical and climatic test methods - part 5: Continuous state, temperature and humidity polarized life test
TS EN 60749-8 Semiconductor components - Mechanical and climatic test methods - part 8: Sealing
TS EN 60749-16 Semiconductor components - Mechanical and climatic test methods - Part 16: Determination of particle impact noise (PCGT)
TS EN 60749-17 Semiconductor components - Mechanical and climatic test methods - part 17: Neutron irradiation
TS EN 60749-18 Semiconductor components - Mechanical and climatic test methods - part 18: Ionizing radiation (total dose)
TS EN 60749-19 Semiconductor elements - Mechanical and climatic test methods - part 19: Chip breaking strength
TS EN 60749-20 Semiconductor components - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated surface mounted elements to the effect of moisture and soldering temperature together
TS EN 60749-22 Semiconductor elements - Mechanical and climatic test methods - part 22: Fastening strength
TS EN 60749-31 Semiconductor elements - Mechanical and climatic test methods - part 31: Flammability of plastic housing elements (internal)
TS EN 60749-14 Semiconductor elements - Mechanical and climatic test methods - part 14: Stiffness of the terminals (leg integrity)
TS EN 60749-32 Semiconductor elements - Mechanical and climatic test methods - part 32: Flammability of plastic housing elements (occurring outside)
TS EN 60749-36 Semiconductor components - Mechanical and climatic test methods - part 36: Acceleration, steady state
TS EN 60749-23 Semiconductor components - Mechanical and climatic test methods - part 23: High temperature operating life
TS EN 60749-24 Semiconductor components - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Non-polarized, accelerated stress test (ahzd)
TS EN 60749-25 Semiconductor components - Mechanical and climatic test methods - part 25: Temperature cycle
TS EN 60749-30 Semiconductor components - Mechanical and climatic test methods - Part 30: Preconditioning of non-sealed surface-mounted components prior to reliability testing
TS EN 60749-2 Semiconductor devices - mechanical and air conditioning test methods - Part 2: Low air pressure
TS EN 60749-20-1 Semiconductor elements - Mechanical and climatic test methods - Part 20-1: Manually transport, packaging, labeling and transport of surface-mounted elements sensitive to the combined effect of moisture and soldering temperature
TS EN 60749-27 Semiconductor devices - Mechanical and climate test methods - Part 27: Electrostatic discharge (esd) sensitivity test - Machine model (mm)
TS EN 60749-3 Semiconductor devices - mechanical and air conditioning test methods - Part 3: External external inspection
TS EN 60749-33 Semiconductor circuits - Mechanical and climate test methods - Part 33: Accelerated moisture resistance - unbiased autoclave
TS EN 60749-35 Semiconductor devices - Mechanical and climate test methods - Part 35: Acoustic microscopy for electronic components with plastic caps
TS EN 60749-37 Semiconductor elements - Mechanical and climatic test methods - Part 37: Test method for lowering to ground level using an accelerator
TS EN 60749-38 Semiconductor elements - Mechanical and climatic test methods - Part 38: Small fault test method for memory semiconductor elements
TS EN 60749-32 / A1 Semiconductor elements - Mechanical and climatic test methods - Part 32: Flammability of plastic housing elements (external)
TS EN 60749-19 / A1 Semiconductor components - Mechanical and climatic test methods - Part 19: Chip breaking strength
TS EN 60749-32 / A1: 2010 Semiconductor elements - Mechanical and climatic test methods - Part 32: Flammability of plastic housing elements (occurring outside)
Semiconductor components - Mechanical and climatic test methods - Part 60749: Preconditioning of non-sealed surface mounted components prior to reliability testing TS EN 30-2005: 1 / A2011: 30
Semiconductor components - Mechanical and climatic test methods - Part 60749: High temperature service life TS EN 23-2004: 1 / A2011: 23
TS EN 62047-2 Semiconductor circuits - Micro electromechanical devices - Part 2: Elongation test method of thin film materials
TS EN 62047-4: 2010 Semiconductor circuits - Micro electromechanical devices - Part 4: General specification for Mems
TS EN 62047-3 Semiconductor circuits - Micro electromechanical devices - Part 3: Thin film standard test piece for elongation test
TS EN 62047-6 Semiconductor circuits - Microelectromechanical devices - Part 6: Methods for coaxial fatigue testing of thin film materials
62374-1: 2010 / AC: 2011 Semiconductor devices - Part 1: Time-dependent dielectric breakage for door dielectric films (tddb)
TS EN 62415: 2010 Semiconductor devices - Constant current electromigration test