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Other Semiconductor Elements Standards

As one of the largest and most experienced organizations in certification with more full-time audit experts than any other certification body in the world, we provide certification services in all standards listed below.

 

TS EN 60747-16-1 Semiconductor devices-Section 16-1: Integrated microwave circuits-Amplifiers

TS EN 60747-16-4 Semiconductor circuits - Part 16-4: Microwave integrated circuits - Switches

TS EN 62384 Electronic control for direct current (da) or alternating current (aa) supply for light emitting diode (LED) modules - Performance characteristics

TS EN 60747-16-4 Semiconductor components - Part 16-4: Microwave integrated circuits - Switches

TS EN 62031 Led modules - For general lighting - Safety features

TS EN 62258-1 Semiconductor membrane products - Part 1: Terms of use and supply

TS EN 60747-16-4 / A1Semi conductor elements - Part 16-4: Microwave integrated circuits - Switches

TS EN 60947-1: 2007 / A1: 2011 Low-voltage switchgear and controlgear - Part 1: General rules

TS EN 60747-15 Single semiconductor elements - Part 15: Isolated semiconductor power elements

TS EN 62047-13: 2012 (EN) Semiconductor elements - Microelectromechanical elements - Part 13: Bending and breaking type test methods for measuring adhesion strength for Mems structures

TS EN 62047-14 Semiconductor elements - Microelectromechanical elements - Part 14: Determination of the boundary measurement method of metallic film materials

TS EN 62031 / A1 Led modules - For general lighting - Safety-related features

TSE CLC / EN 62258-4 Semiconductor molding products - Part 4: Survey for mold users and suppliers

TS EN 60747-16-5 Semiconductor components - Part 16-5: Microwave integrated circuits - Oscillators

TS EN 62047-11 Semiconductor elements - Micro-electromechanical elements - Part 11: Test method for linear thermal expansion coefficients of free-standing materials for micro-electromechanical systems

TS EN 62047-18 Semiconductor elements - Micro-electromechanical elements - Part 18: Bending test methods of thin film materials

TS EN 62047-19 Semiconductor components - Micro-electromechanical elements - Part 19: Electronic compasses

TS EN 62047-20 Semiconductor elements - Micro-electromechanical elements - Section 20: Gyroscopes

TS EN 62047-21 Semiconductor elements - Micro-electromechanical elements - Part 21: Test method for Poisson's ratio of thin film MEMS materials

TS EN 62047-1 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions

TS EN 62047-26 Semiconductor elements - Micro electromechanical elements - Description and measurement methods for micro hollow and needle structures

TS EN 62047-25 Semiconductor devices - Micro electromechanical devices - Part 25: Silicon-based MEMS production technology - Tensile press and shear force measurement method of micro bonding area

TS EN 62031 / A2 LED modules - For general lighting - Safety-related features

TS EN 62384 / A1 Electronic control with direct current (da) or alternating current (aa) supply for light emitting diode (led) modules - Performance characteristics

TS EN 60747-16-1 / A1 Semiconductor circuits - Part 16-10: Technology approval scheme for single chip microwave integrated circuits (tas)

TS EN 60747-16-4: 2004 / A1: 2011Semi-conducting elements - Part 16-4: Microwave integrated circuits - Switches

TS EN 61051-1 Varistors for electronic equipment - Part 1: General specifications