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Semiconductor Elements Standards

We carry out your testing and inspection procedures in accordance with the following standards of services in accordance with national and international regulations and standards. We serve all the standards below.

 

TS EN 120001 Empty detail features: Light emitting diodes, light emitting diode arrays, light emitting diode indicators without internal logic and resistors

TS EN 120002 Empty detail features: Infrared light emitting diodes, infrared light emitting diode arrays

TS EN 120003 Blank detail specification: Phototransistors, photo darlington transistors, phototransistors

TS EN 120004 Blank detail specification: Phototransistors with phototransistor output media declared value

TS EN 120005 Blank detail specification: Photodiodes photodiode arrays (not used in fiber optic applications)

TS EN 120007 Blank detail features: Liquid crystal displays, monochrome lcd without electronic circuit

TS EN 60747-16-1 Semiconductor devices-Section 16-1: Integrated microwave circuits-Amplifiers

TS EN 60749-10 Semiconductor devices-Mechanical and air conditioning tests-Part 10: Mechanical impact

TS EN 60749-11 Semiconductor devices - Mechanical and air conditioning test methods - Part 11: Rapid temperature change - Dual liquid bath method

TS EN 60749-12 Semiconductor devices-Mechanical and air conditioning tests-Part 12: Vibration, variable frequency

TS EN 60749-13 Semiconductor devices-Mechanical and air conditioning tests and methods-Part 13: Saline atmosphere

TS EN 60749-2 Semiconductor devices - Mechanical and air conditioning tests - Part 2: Low air pressure

TS EN 60749-3 Semiconductor devices - Air conditioning and mechanical test method - Part 3: External visual inspection

TS EN 60749-4 Semiconductor devices - Mechanical and air conditioning test methods - Part 4: Wet temperature steady state, highly accelerated strain test (hast)

TS EN 60749-6 Semiconductor devices - Mechanical and air conditioning test methods - Part 6: Storage at high temperatures

TS EN 60749-9 Semiconductor devices - Mechanical and air conditioning test methods - Part 9: Persistence of marking

TS EN 61643-321 Components for low-voltage surge protection devices - Part 2: Properties for avalanche refraction diodes (USA)

TS EN 60749-1 Semiconductor circuits - Mechanical and climate test methods - Section 1: General

TS EN 60749-5 Semiconductor circuits - Mechanical and climate test methods - Part 5: Continuous state temperature humidity slope (bias) life test

TS EN 60749-8 Semiconductor circuits - Mechanical and climatic test methods - Section 8: Sealing

TS EN 60749-16 "semiconductor devices - Mechanical and climatic test methods - part 16: Particle impact noise detection (PIND)"

TS EN 60749-17 Semiconductor circuits - Mechanical and climate test methods - Section 17: Neutron radiation

TS EN 60749-18 Semiconductor circuits - Mechanical and climate test methods - Section 18: Ionizing radiation (total dose)

TS EN 60749-19 Semiconductor circuits - Mechanical and climatic test methods - Section 19: Die shear intensity

TS EN 60749-22 Semiconductor circuits - Mechanical and climate test methods - Part 22: Bond strength

TS EN 60749-31 Semiconductor circuits - Mechanical and climate test methods - Section 31: Flammability of plastic encapsulated circuits

TS EN 60749-32 Semiconductor circuits - Mechanical and climate test methods - Section 31: Flammability of plastic encapsulated circuits

TS EN 60749-36 Semiconductor circuits - Mechanical and climatic test methods - Section 36: Acceleration, steady state

TS EN 60749-14 Semiconductor circuits - Mechanical and climatic test methods - Section 14: Robustness of terminations lead integrity

TS EN 60749-23 Semiconductor circuits - Mechanical and climate test methods - Section 23: High temperature operating life

TS EN 60749-24 Semiconductor circuits - Mechanical and climate test methods - Section 24: Accelerated moisture resistance, unbiased (ill)

TS EN 60749-25 Semiconductor circuits - Mechanical and climatic test methods - Part 25: Temperature cycle

TS EN 60747-16-4 Semiconductor circuits - Part 16-4: Microwave integrated circuits - Switches

TS EN 60749-30 Semiconductor circuits - Mechanical and climatic test methods - Section 30: Pre-conditioning of non-hermetic surface-mounted circuits before reliability testing

TS EN 62384 Electronic control for direct current (da) or alternating current (aa) supply for light emitting diode (LED) modules - Performance characteristics

TS EN 62007-2 Semiconductor optoelectronic devices for fiber optic system applications - Part 2: Measurement methods

TS EN 60747-16-4 Semiconductor components - Part 16-4: Microwave integrated circuits - Switches

TS EN 60749-20 Semiconductor elements - Mechanical and climatic test methods - Section 20: Resistance of plastic encapsulated smd to the combined effect of moisture and soldering heat

TS EN 62031 Led modules - For general lighting - Safety features

TS EN 62258-1 Semiconductor membrane products - Part 1: Terms of use and supply

TS EN 60749-19 / A1 Semiconductor components - Mechanical and climatic test methods - Part 19: Chip breaking strength

TS EN 61975 High voltage direct current installation - System tests

TS EN 62418 Semiconductor devices - Test of tension of metal properties

TS EN 60747-16-4 / A1Semi conductor elements - Part 16-4: Microwave integrated circuits - Switches

TS EN 60947-1: 2007 / A1: 2011 Low-voltage switchgear and controlgear - Part 1: General rules

TS EN 62374-1 Semiconductor devices - Part 1: Time-dependent dielectric breakage for door dielectric films (tddb)

TS EN 60749-30 / A1 Semiconductor components - Mechanical and climatic test methods - Part 30: Preconditioning of non-sealed surface-mounted components prior to reliability testing

TS EN 62047-8 Semiconductor circuits - Micro electromechanical devices - Part 8: Strip bending test method for measuring the elongation property of thin films

TS EN 60749-15 Semiconductor elements - Mechanical and climatic test methods - Part 15: Resistance to brazing temperature for hole-mounted elements

TS EN 60749-15: 2010 / AC Semiconductor elements - Mechanical and climatic test methods - Part 15: Resistance to brazing temperature for hole-mounted elements

TS EN 60749-21 Semiconductor components - Mechanical and climatic test methods - Part 21: Solderability

TS EN 60749-29 Semiconductor elements - Mechanical and climatic test methods - Part 29: Lockout test

TS EN 62047-5 Semiconductor circuits - Micro-electromechanical devices - Part 5: RF MEMS switches

TS EN 62047-7 Semiconductor circuits - Micro electromechanical devices - Part 7: Radio frequency control and mems baw filter for selection

TS EN 62047-9 Semiconductor circuits - Micro-electromechanical devices - Part 9: Measurement of plate-to-plate bond strength for Mems

TS EN 60749-40 Semiconductor devices - Mechanical and air conditioning test methods - Part 40: Test method of plate boundary drop using stain device

TS EN 62047-10 Semiconductor circuits - Microelectromechanical devices - Part 10: Measurement of elongation property of thin films for Mems materials

TS EN 62047-12 Semiconductor circuits - Micro electromechanical devices - Part 12: Bending fatigue test methods of thin film materials using resonance vibration of Mems structures

TS EN 60749-34 Semiconductor components - Mechanical and climatic test methods - Part 34: Power cycling

TS EN 60747-15 Single semiconductor elements - Part 15: Isolated semiconductor power elements

TS EN 62047-13: 2012 (EN) Semiconductor elements - Microelectromechanical elements - Part 13: Bending and breaking type test methods for measuring adhesion strength for Mems structures

TS EN 62047-14 Semiconductor elements - Microelectromechanical elements - Part 14: Determination of the boundary measurement method of metallic film materials

TS EN 61954 Static VAR (reactive power) compensators (SVC) - Tests for thyristor valves

tst ISO / IEC 10373-2 Identification cards - Test methods - Part 2: Magnetic stripe cards  

TS EN 60191-6-12 Mechanical standardization of semiconductor devices - Part 6-12: General guidelines for the preparation of surface-mounted semiconductor device packages - Design guide for regular spacing grid design (FLGA)

TS EN 60749-27 / A1 Semiconductor devices - Mechanical and climate test methods - Part 27: Electrostatic discharge (esd) sensitivity test - Machine model (mm)

TS EN 62031 / A1 Led modules - For general lighting - Safety-related features

TS EN 60191-6-22 Mechanical standardization of semiconductor elements - Part 6-22: General rules for the preparation of outline drawings of surface-mounted semiconductor element packages -Silicon Thin-step Top Grid Array and Silicon Thin-step Islet Grid Array Design for Silicon Thin Step Islet Grid Array Semiconductor Packages manual (S-FBGA and S-FLGA)

TSE CLC / EN 62258-4 Semiconductor molding products - Part 4: Survey for mold users and suppliers

TS EN 60747-5-5 Individual semiconductor devices and integrated circuits-Part 5-3: Optoelectronic devices-Photocouplers

TS EN 60747-16-5 Semiconductor components - Part 16-5: Microwave integrated circuits - Oscillators

TS EN 61954 / A1 Static VAR compensators (SVC) -Tristor valve tests

TS EN 62047-11 Semiconductor elements - Micro-electromechanical elements - Part 11: Test method for linear thermal expansion coefficients of free-standing materials for micro-electromechanical systems

TS EN 62047-18 Semiconductor elements - Micro-electromechanical elements - Part 18: Bending test methods of thin film materials

TS EN 62047-19 Semiconductor components - Micro-electromechanical elements - Part 19: Electronic compasses

TS EN 60191-3 Mechanical standardization of semiconductor elements - part 3: General rules for the preparation of outline drawings of integrated circuits

TS EN 60191-4 Mechanical standardization for semiconductor element packages - Part 4: Classification of package main dimensions for semiconductor elements according to models and coding system

TS EN 61954 / A1 Static VAR (reactive power) compensators (SVC) - Tests for thyristor valves (IEC 61954: 2011 / A1: 2013)

TS EN 60749-26 Semiconductor components - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity tests - Human body model (HBM)

TS EN 62047-20 Semiconductor elements - Micro-electromechanical elements - Section 20: Gyroscopes

TS EN 62047-21 Semiconductor elements - Micro-electromechanical elements - Part 21: Test method for Poisson's ratio of thin film MEMS materials

TS EN 60749-42 Semiconductor elements - Mechanical and climate test methods - Part 42: Temperature and humidity test chambers

TS IEC 60050-521 International Electrotechnical Glossary - Part 521: Semiconductor elements and integrated circuits

TS IEC 60191-5 Mechanical standardization of semiconductor circuits Section 5: Recommendations for combined circuit packages using automatic splicing tape

TS EN 62047-1 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions

TS EN 62047-26 Semiconductor elements - Micro electromechanical elements - Description and measurement methods for micro hollow and needle structures

TS EN 62779-2 Semiconductor devices - Semiconductor interfaces for human body communication - Part 2: Characterization of interface performances

TS EN 62779-1 Semiconductor devices - Semiconductor interfaces for human body communication - Part 1: General rules

TS EN 62779-3 Semiconductor devices - Semiconductor interfaces for human body communication - Part 3: Functional type and operating conditions

TS EN 60749-44 Semiconductor elements - Mechanical and climatic test methods - Neutron beam irradiated single event effect (SEE) test method for semiconductor devices

TS EN 60191-6-13 Mechanical standardization of semiconductor devices - Part 6-13: Design guide for regular spaced grid arrangement (FLGA) and grid arrangement of fine holes (FBGA) (FBGA / FLGA)

TS EN 62047-25 Semiconductor devices - Micro electromechanical devices - Part 25: Silicon-based MEMS production technology - Tensile press and shear force measurement method of micro bonding area

TS EN 62031 / A2 LED modules - For general lighting - Safety-related features

TS EN 60191-1 Mechanical standardization of semiconductor elements - Part 1: General rules for the preparation of outline drawings of discrete elements

TS EN 60191-6 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface-mounted semiconductor circuit packages

TS EN 60191-6-20: Mechanical standardization of semiconductor devices - Part 2010-6: General rules for the preparation of sketches of packages for surface-mounted semiconductor devices - Measurement methods for the dimensions of small draft j-pin packages (ktj)

TS EN 60191-6-17: 2011 Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of draft drawings of packages for surface-mounted semiconductor design guidelines for stacked packages - Design guide for regular spacing and regular spacing grid layout ppfbga and p-Pflga)

TS EN 60191-6-16 Mechanical standardization of semiconductor elements - Part 6-16: Glossary of practice sockets and semiconductor tests for bga, lga, fbga and flga

TS EN 60191-6-18 Mechanical standardization of semiconductor devices - Part 6-18: General rules for preparing outline drawings of the surface mount of semiconductor device packages - Design guide for the round grid array

TS EN 62384 / A1 Electronic control with direct current (da) or alternating current (aa) supply for light emitting diode (led) modules - Performance characteristics

TS EN 60747-16-1 / A1 Semiconductor circuits - Part 16-10: Technology approval scheme for single chip microwave integrated circuits (tas)

Semiconductor components - Part 60747-16: Microwave integrated circuits - Switches TS EN 4-2004-1: 2011 / A16: 4

TS EN 60749-4 Semiconductor devices - mechanical and air conditioning test methods - Part 4: Wet temperature, steady state, highly accelerated forcing test (yhzd)

TS EN 60749-6 Semiconductor devices - mechanical and air conditioning test methods - Part 6: High temperature storage

TS EN 60749-1 Semiconductor components - Mechanical and climatic test methods - part 1: General

TS EN 60749-5 Semiconductor elements - Mechanical and climatic test methods - part 5: Continuous state, temperature and humidity polarized life test

TS EN 60749-8 Semiconductor components - Mechanical and climatic test methods - part 8: Sealing

TS EN 60749-16 Semiconductor components - Mechanical and climatic test methods - Part 16: Determination of particle impact noise (PCGT)

TS EN 60749-17 Semiconductor components - Mechanical and climatic test methods - part 17: Neutron irradiation

TS EN 60749-18 Semiconductor components - Mechanical and climatic test methods - part 18: Ionizing radiation (total dose)

TS EN 60749-19 Semiconductor elements - Mechanical and climatic test methods - part 19: Chip breaking strength

TS EN 60749-20 Semiconductor components - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated surface mounted elements to the effect of moisture and soldering temperature together

TS EN 60749-22 Semiconductor elements - Mechanical and climatic test methods - part 22: Fastening strength

TS EN 60749-31 Semiconductor elements - Mechanical and climatic test methods - part 31: Flammability of plastic housing elements (internal)

TS EN 60749-14 Semiconductor elements - Mechanical and climatic test methods - part 14: Stiffness of the terminals (leg integrity)

TS EN 60749-32 Semiconductor elements - Mechanical and climatic test methods - part 32: Flammability of plastic housing elements (occurring outside)

TS EN 60749-36 Semiconductor components - Mechanical and climatic test methods - part 36: Acceleration, steady state

TS EN 60749-23 Semiconductor components - Mechanical and climatic test methods - part 23: High temperature operating life

TS EN 60749-24 Semiconductor components - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Non-polarized, accelerated stress test (ahzd)

TS EN 60749-25 Semiconductor components - Mechanical and climatic test methods - part 25: Temperature cycle

TS EN 60749-30 Semiconductor components - Mechanical and climatic test methods - Part 30: Preconditioning of non-sealed surface-mounted components prior to reliability testing

TS EN 60749-2 Semiconductor devices - mechanical and air conditioning test methods - Part 2: Low air pressure

TS EN 60749-20-1 Semiconductor elements - Mechanical and climatic test methods - Part 20-1: Manually transport, packaging, labeling and transport of surface-mounted elements sensitive to the combined effect of moisture and soldering temperature

TS EN 60749-27 Semiconductor devices - Mechanical and climate test methods - Part 27: Electrostatic discharge (esd) sensitivity test - Machine model (mm)

TS EN 60749-3 Semiconductor devices - mechanical and air conditioning test methods - Part 3: External external inspection

TS EN 60749-33 Semiconductor circuits - Mechanical and climate test methods - Part 33: Accelerated moisture resistance - unbiased autoclave

TS EN 60749-35 Semiconductor devices - Mechanical and climate test methods - Part 35: Acoustic microscopy for electronic components with plastic caps

TS EN 60749-37 Semiconductor elements - Mechanical and climatic test methods - Part 37: Test method for lowering to ground level using an accelerator

TS EN 60749-38 Semiconductor elements - Mechanical and climatic test methods - Part 38: Small fault test method for memory semiconductor elements

TS EN 60749-32 / A1 Semiconductor elements - Mechanical and climatic test methods - Part 32: Flammability of plastic housing elements (external)

TS EN 60749-19 / A1 Semiconductor components - Mechanical and climatic test methods - Part 19: Chip breaking strength

TS EN 60749-32 / A1: 2010 Semiconductor elements - Mechanical and climatic test methods - Part 32: Flammability of plastic housing elements (occurring outside)

Semiconductor components - Mechanical and climatic test methods - Part 60749: Preconditioning of non-sealed surface mounted components prior to reliability testing TS EN 30-2005: 1 / A2011: 30

Semiconductor components - Mechanical and climatic test methods - Part 60749: High temperature service life TS EN 23-2004: 1 / A2011: 23

TS EN 61051-1 Varistors for electronic equipment - Part 1: General specifications

TS EN 61051-1 Varistors for electronic equipment - Part 1: General specifications

TS EN 61954: 2011 Tests of thyristor valves for static electrically compensated power electron (ICS) systems for electrical transmission and distribution systems

TS EN 62047-2 Semiconductor circuits - Micro electromechanical devices - Part 2: Elongation test method of thin film materials

TS EN 62047-4: 2010 Semiconductor circuits - Micro electromechanical devices - Part 4: General specification for Mems

TS EN 62047-3 Semiconductor circuits - Micro electromechanical devices - Part 3: Thin film standard test piece for elongation test

TS EN 62047-6 Semiconductor circuits - Microelectromechanical devices - Part 6: Methods for coaxial fatigue testing of thin film materials

62374-1: 2010 / AC: 2011 Semiconductor devices - Part 1: Time-dependent dielectric breakage for door dielectric films (tddb)

TS EN 62415: 2010 Semiconductor devices - Constant current electromigration test

TS EN 62416: 2010 Semiconductor devices - Hot transport test in Mos transistors

TS EN 120003 Blank detail feature: Phototransistors, photodarlington transistors, phototransistor arrays

TS EN 120004 Empty detail feature: Phototransistor with phototransistor output

TS EN 120007 Blank detail specifications - liquid crystal displays, monochrome lcds without electronics

TS EN 153000 General specifications: Discrete printing contact power semiconductor devices