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TS EN 60191-6-3 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of draft drawings of surface mounted semiconductor device packages - Measurement methods for the dimensions of quadrature flat packages (qfp)
TS EN 60191-6-6 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of draft drawings of surface-mounted semiconductor device packages
TS EN 60191-6-1 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of sketches of packages for surface mounted semiconductor devices - Design guide for seagull wing terminals
TS EN 60191-6-2 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of draft drawings of packs of surface-mounted semiconductor devices-1,50 mm, 1,27 mm and 1,00 mm Design guide for packages
TS EN 60191-6-5 Mechanical standardization for semiconductor devices -General rules for the preparation of draft drawings of surface-mounted semiconductor device packages-Design guide for the grid layout of thin holes
TS EN 60191-6-8 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of surface-mounted semiconductor device packages - Design guide for glass with ceramic sealing element (G-QFP)
TS EN 60191-6-4 Mechanical standardization of semiconductor circuits - Part 6-4: General rules for the preparation of master plan drawings of surface mounted semiconductor circuit packages - Measuring methods for package measurements of round grid array (BGA)
TS EN 60297-3-101 Mechanical structures of electronic devices - Dimensions of mechanical structures of the 482,6 mm (19 inch) series - Part 3-101: Auxiliary shelves and pluggable units
TS EN 60297-3-104 Mechanical structures for electronic equipment - Dimensions of mechanical structures belonging to the 482,6 mm (19 inch) series - Part 3-104: Connector dependent interface dimensions for lower racks and socket units
TS EN 60917-2-4 Modular layout for the development of mechanical structures in electronic hardware applications 2-4: Part specifications - Interface coordination dimensions for 25 mm hardware application - Lower shelves or cabinets according to IEC 60297-3-100 Adaptation dimensions for chassis
TS EN 60297-3-106 Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 inch) series - Part 3-106: Adaptation for sub-shelves and chassis applicable to metric cabinets or shelves according to IEC 60917-2-1 dimensions
TS EN 60191-6-21 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of sketches of packages for surface mounted semiconductor devices -Measuring methods for the dimensions of small draft packages (kta)
TS EN 60191-6-12 Mechanical standardization of semiconductor devices - Part 6-12: General guidelines for the preparation of surface-mounted semiconductor device packages - Design guide for regular spacing grid design (FLGA)
TS EN 61969-1 Mechanical structures of electronic devices - External enclosures - Part 1: Design guidelines
TS EN 61969-2 Mechanical structures of electronic devices - External enclosures - Part 2: Partial feature - Dimensions for sheaths and cabinets
TS EN 61969-3: 2012 (EN) for electronic equipment - Mechanical structures - Outdoor enclosures - Part 3: Part feature standard, safety conditions for cabins and chassis, climatic mechanical tests
TS EN 61587-1 Mechanical structures for electronic devices - Tests for IEC 60917 and IEC 60297 - Part 1: Climatic tests for cabinets, shelves, sub-shelves and chassis, mechanical tests and safety considerations
TS EN 60297-3-107 Mechanical structures for electronic equipment - Dimensions of the 482,6 mm (19 in) series mechanical structures - Part 3- 107: Dimensions of the subframe and plug unit, small shape factor
TS EN 60917-2-5 Modular sequencing for the development of mechanical structures for electronic hardware applications - Part 2-5: Part features - Interface coordination dimensions for 25 mm hardware application - Cab interface dimensions for various hardware
TS EN 61587-4 Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 4: Combining performance levels for modular cabins
TS EN 61587-3 Mechanical structures for electronic devices - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic screening performance tests for cabins, roofs and drawers
TS EN 61587-1 Mechanical structures for electronic devices - Tests for IEC 60917 and IEC 60297 standard series - Part 1: Environmental requirements for cabinets, shelves, sub-shelves and chassis under indoor conditions, test setup and safety considerations
TS EN 60286-3 Packaging of components for automatic machining section 3: Packaging of elements placed on the surface on continuously moving strips
TS EN 61191-1 Printed circuit installations - Part 1: General standard - Requirements for soldered electrical and electronic installations using surface-mounted and related installation technologies
TS EN 62739-1 Test method for erosion in corrugated soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for non-surface treated metal materials
TS EN 61191-2 Printed circuit units - Part 2: Part feature: Requirements for the surface mounted on soldered units
TS EN 60286-3 / AC Packaging of components for automatic machining part 3: Packaging of elements placed on the surface on continuously moving strips
TS EN 60286-4 Electronic circuit elements - Packaging for automatic processing - Part 4: Adhesive cartridges for electronic elements packed in E and g
TS EN 62610-4 Mechanical structures for electronic equipment - Temperature management for cabinets according to IEC 60297 and IEC 60917 series - Part 4: Cooling performance tests for water-fed heat exchangers in electronic cabinets
TS EN 61587-5 Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 5: Seismic tests for chassis, sub-shelves and plug units
TS EN 60297-3-108 Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-108: Dimensions of R-type bottom shelves and removable units
TS EN 61587-1 / D1 Mechanical structures for electronic devices - Tests for IEC 60917 and IEC 60297 standard series - Part 1: Environmental requirements for enclosures, shelves, sub-shelves and chassis under building conditions, test setup and safety considerations
TS EN 60297-3-109 Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm series - Part 3 - 109: Chassis dimensions for embedded computing devices
TS EN 62610-5 Mechanical structures for electrical and electronic equipment - Thermal management of cabinets according to IEC 60297 and IEC 60917 series - Cooling performance evaluation for enclosed cabinets
TS EN 62739-2 Test method for erosion in corrugated soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for surface treated metal materials
TS EN 62739-3 Test method for erosion in corrugated soldering equipment using molten lead-free solder alloy - Part 3: Erosion test methods selection guide
TS EN 60191-6-6 Mechanical standardization of semiconductor elements - Part 6-6: General guidelines for the preparation of outline drawings of surface-mounted semiconductor element packages - Design guide for regularly spaced grid array (flga)
TS EN 60191-1 Mechanical standardization of semiconductor elements - Part 1: General rules for the preparation of outline drawings of discrete elements
TS EN 60191-6 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface-mounted semiconductor circuit packages
TS EN 60191-6-19 Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at high temperatures and maximum permissible warpage
TS EN 60191-6-20: Mechanical standardization of semiconductor devices - Part 2010-6: General rules for the preparation of sketches of packages for surface-mounted semiconductor devices - Measurement methods for the dimensions of small draft j-pin packages (ktj)
TS EN 60191-6-10 Mechanical standardization of semiconductor circuits - Part 6-10: General rules for the preparation of master plan drawings of surface mounted semiconductor circuits - Measurement methods for P-Vson measurements
TS EN 60191-6-16 Mechanical standardization of semiconductor elements - Part 6-16: Glossary of practice sockets and semiconductor tests for bga, lga, fbga and flga
TS EN 60297-3-103 Mechanical structures of electronic devices - Dimensions of mechanical structures of the 482,6 mm (19 inch) series - Part 3-103: Switching and alignment adjustment pin
TS EN 60297-3-105 Mechanical structures for electronic devices - Dimensions of the 482,6 mm (19 in) series mechanical structures - Part 3-105: Dimensions and design conditions for 1 chassis
TS EN 60297-3-100 Mechanical structures for electronic devices - Dimensions of 482,6 mm (19 in) series mechanical structures - Part 3-100: Basic dimensions of front panels, lower shelves, chassis, shelves and cabinets
TS EN 60297-3-102 Mechanical structures of electronic devices - Dimensions of mechanical structures of the 482,6 mm (19 inch) series - Part 3-102: Injector / extractor handle
TS EN 60297-3-101 Mechanical structures for electronic equipment - 482,6 mm (19 inch) series mechanical construction dimensions - Part 3-101: Lower shelves and combined plug-in units - Electrostatic discharge protection
TS EN 60749-39 Semiconductor devices - Mechanical and climate test methods - Part 39: Measurement of moisture dissolution and water solubility in organic materials used for semiconductor elements
TS EN 60917-1 Modular arrangement for the development of mechanical structures in electronic hardware applications - Part 1: General standard
TS EN 60917-2-3 Modular range for the development of mechanical structures for electronic hardware applications - Part 2-3: Part feature - Interface coordination dimensions for 25 mm hardware application - Extended detail feature - Lower shelf frame, rear planes, front planes and Dimensions for socket units
TS EN 61837-2: 2011 (EN) Surface-mounted piezoelectric devices for frequency control and selection - Standard drafts and terminal front connections - Part 2: Ceramic housing
TS EN 61969-2-1 Mechanical structures of electronic devices - External enclosures - Part 2-1: Detail specifications - Dimensions of cabinets
TS EN 61969-2-2 Mechanical structures for electronic equipment - External enclosures section 2-2: Detail specifications - Dimensions of cabinets
TS EN 62194 Method for evaluating the thermal performance of housings