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TS EN 61249-5-1 Materials for interconnection structures - Part 5: Particle group for coated and uncoated conductive foils and films - Part 1: Copper foils (for manufacturers of copper-plated base materials)
TS EN 61249-5-4 Materials for interconnection structures - Part 5: Partial property group for coated and uncoated conductive foils and films 4: Conductive inks
TS EN 61249-8-7 Materials for interconnection structures - Part 8: Particle group for non-conductive films and coatings - Part 7: Marking inks
TS EN 62326-4 Printed circuit boards - Part 4: Rigid multi-layer printed circuit boards with intermediate layer connections - Part specifications
TS EN 62326-4-1 Printed circuit boards - Part 4: Rigid multilayer printed circuit boards with intermediate layer connections - Part specifications - Part 1: Capability detail specifications - Performance level a, b and c
TS EN 61193-1 Quality assessment systems - Part 1: Faults and analysis of printed plate systems.
TS EN 61249-2-18 Materials for printed boards and other interconnection structures - Part 2-4: Reinforced base material - Coated and uncoated - Reinforced copper-coated non-woven fiberglass reinforced laminated sheet (vertical combustion test) (ic 61249-2) -18: 2001)
TS EN 61249-2-19 Materials for printed plates and other interconnection structures - Part 2-19: Reinforced base material - Coated and uncoated - Reinforced laminated sheet coated with epoxy cross-folded linear fibercam (vertical combustion test) (icec) 61249-2-19: 2001)
TS EN 61249-2-4 Materials for printed plates and other interconnection structures - Part 2-4: Reinforced base material - Coated and uncoated - Flammable copper-coated polyester textured / nonwoven fibercam laminated sheet (vertical combustion test) (ic 61249-) 2-4: 2001)
TS EN 61249-2-7 Materials for printed plates and other interconnection structures - Part 2-7: Reinforced uncoated and base material coatings - Copper and coated epoxy e-Glass laminated sheet with determined flammability
TS EN 61249-2-5 Materials and other interconnection structures for printed circuits - Part 2-5: Reinforced base materials without sheath and sheath - Flammability defined (vertical combustion test) brominant epoxide cellulose paper, self / wool e-Glass reinforced surfaces laminate leaves, copper sheathed
TS EN 61189-2 Test methods for electrical materials, interconnected structures and fittings - Part 2: Test methods for materials used in interconnected structures
TS EN 60194 Printed circuit board design, manufacturing and installation - Terms and definitions
TS EN 61249-4-16 Materials for printed circuit boards and other interconnection structures - Part 4-16: Part specification set for uncoated, impregnated materials (for the manufacture of multi-layer cards) - Flammability defined for lead-free devices (vertical ignition test) multifunction impregnated non-halogenated epoxy fabric e-Glass
TS EN 61249-4-15 Materials for printed circuit boards and other interconnection structures - Part 4-15: Part specification set for uncoated, impregnated materials (for the manufacture of multi-layer cards) - Flammability defined for lead-free devices (vertical ignition test) multifunction impregnated epoxy fabric E-Glass
TS EN 61249-2-37 Materials for printed circuit boards and other interconnection structures - Part 2-37: Reinforced base materials, coated and uncoated - Modified non-halogenated, flammability (vertical ignition test), epoxy fabric e-Glass sheet sheets, copper plating for lead-free fittings
TS EN 61249-2-35 Materials for printed circuit boards and other interconnection structures - Part 2-35: Reinforced base materials, coated and uncoated - Identified flammability (vertical ignition test), modified epoxy fabric e-Glass sheets, lead-free assembly for copper plating
TS EN 61249-2-27 Materials for printed circuit boards and other interconnection structures - Part 2-27: Coated or uncoated reinforced base materials - Bismelamide modified with non-halogenated epoxy glass fabric laminate with defined flammability (vertical ignition test) / triazine, copper plated
TS EN 61249-2-30 Materials for printed circuit boards and other interconnection structures - Part 2-30: Base materials coated or uncoated reinforced - Non halogenated epoxy modified with cyanate ester glass fabric laminate layer of defined flammability (vertical ignition test) , copper coated
TS EN 61249-2-39 Materials for printed circuit boards and other interconnection structures - Part 2-39: Coated or uncoated reinforced base materials - High performance epoxy and epoxy non-epoxy laminate with high performance defined layer, copper clad for legless installation
TS EN 61249-2-40 Materials for printed circuit boards and other interconnection structures - Part 2-40: Base materials coated or uncoated reinforced - High performance non-halogenated epoxy, E-glass fabric laminate with defined flameability (vertical ignition test) layer, copper clad for legless installation
TS EN 61182-2-2 Definition data production and transfer method - Printed Panel Mounting Products Part 2-2: Printed Panel Manufacturing Data Definition for the Implementation of Regional Requirements
TS 13243Authorized services - Rules for graphic-based display devices with LED
TS EN 61249-4-18 Materials for printed circuit boards and other interconnection structures - Part 4-18: Part standard set for resin impregnated materials, uncoated (for the manufacture of multi-layer cards) - Flammability defined for lead-free installation (vertical combustion)
TS EN 61249-4-19 Materials for printed circuit boards and other interconnection structures - Part 4-19: Part standard set for resin impregnated materials, uncoated (for the manufacture of multi-layer cards) - Flammability defined for lead-free installation (vertical side)
TS EN 60947-4-3 Low-voltage switching and control devices - Part 4-3: Contactors and motor starters - AA semiconductor control devices and contactors for non-motorized loads
TS EN 60947-4-3 Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor starters - AA semiconductor control devices and contactors for non-motor loads
TS EN 16602-70-11: 2015 Space product assurance - Supply of printed circuit boards
TS EN 16602-70-10 Space product assurance - Characterization of printed circuits
TS EN 61189-5-2 Test methods for electrical materials, printed circuits and other interconnection structures and units - Part 5-2: General test methods for materials and units - Solder flux for printed circuit units
TS EN 61189-5-3 Test methods for electrical materials, printed circuits and other interconnection structures and units Part 5-3: General test methods for materials and units - Solder paste for printed circuit units
TS EN 61189-5-4 Test methods for electrical materials, printed circuits and other interconnection structures and units Part 5-4: General test methods for materials and units - Solder alloys for printed circuit units and solid wire with or without paste
TS EN 61189-3-719 Test methods for electrical materials, printed circuit boards and other interconnection structures and installations - Part 3- 719: Test methods for interconnection structures (printed cards) - Single-sided coated bore (PTH) during temperature cycle ) monitoring of resistance value change
TS EN 62326-20 Printed Cards - Part 20: Printed circuit boards for high-brightness LEDs
TS EN 61249-2-43 Materials for printed circuit boards and other interconnection structures - Part 2 - 43: Coated and uncoated reinforced basic materials - Halogenated epoxide cellulose paper / woven E-work flammability (vertical ignition test) with glass reinforced laminate sheets, lead-free installation copper plating
TS EN 61249-2-44 Materials for printed circuit boards and other interconnection structures - Part 2 - 44: Coated and uncoated reinforced basic materials - Non-halogenated epoxide nonwoven / woven E-work flammability (vertical ignition test) glass reinforced laminated sheets, lead-free copper coating
TS EN 16602-70-12 Space product assurance - Design rules for printed circuit boards
TS EN 61189-5-1 Test methods for electrical materials, printed circuits and other interconnection structures and units - Part 5-2: General test methods for materials and units - Guidelines for printed circuit assemblies
TS EN 61189-2-719 Test methods for electrical materials, interconnected structures and assemblies - Part 2: Test methods for materials used in interconnected structures - Relative permeability and loss tangent (500 MHz between 10 MHz)
TS 1829 EN 60097 Grating systems for printed circuits
TS EN 61076-4-103 Evaluated quality connectors for da and low-frequency analog and digital high-speed data applications - Part 4: Part features - Printed circuit connectors
TS EN 61086-1 Specifications for coatings used in printed circuit boards - Part 1: Definitions, classification and general rules
TS EN 61086-2 Coatings for printed circuit boards - Part 2: Test methods
TS EN 61086-3-1 Coatings for printed circuit boards - Part 3-1: Specifications for each material - General purpose (class 1), high reliability (class 2) and aerospace (class 3) coatings
TS EN 61188-1-2 Printed circuits and printed circuit groups-Design and use-Section 1-2: General requirements-Controlled impedance
TS EN 61188-5-1 Printed cards and printed card mounting elements - Design and operation - Part 5-1: Connection (free / contact area) considerations - General rules
TS EN 61188-5-2 Printed circuits and printed circuit assembly - Design and use - Part 5-2: Connection points (ground / node); Discrete elements
TS EN 61188-5-3 Printed circuits and printed circuit assembly - Design and use - Part 5-3: Connection considerations (ground / knot), Seagull-Wing components on the 2 side
TS EN 61188-5-4Printed circuits and printed-circuit assembly - Design and use - Part 5-4: Connection considerations (ground / node), j-pin chip carriers on the 2 side
TS EN 61188-5-5 Printed circuits and printed circuit assembly - Design and use - Part 5-5: Connection considerations (ground / knot), Seagull-Wing components on the 4 side
TS EN 61188-5-8 Printed circuits and printed circuit assemblies - Design and use - Part 5-8: Connection considerations (ground / node) - Field array components (bga, fbga, cga, lga)
TS EN 61188-7 Printed circuit board and printed circuit assembly - Design and operation - Part 7: Electronic component zero orientation for cad library structure
TS EN 61189-1 Test methods for electrical materials, interconnected structures and assemblies-Section 1: General test methods and methodology
TS EN 61189 / A1 Test methods for electrical materials, interconnected structures and assemblies - Part 2: Test methods for materials used in interconnected structures
TS EN 61189-1 / A1 Test methods for electrical materials, interconnected structures and assemblies-Section 1: General test methods and methodology
TS EN 61189-3 Test methods for electrical materials, interconnected structures and assemblies -Chapter 3: Test methods for connected constructions (printed circuits)
TS EN 61189-5 Test methods for electrical materials, interconnection structures and fasteners - Part 5: Test methods for printed circuit fasteners
TS EN 61189-6 Test methods for electrical materials, interconnection structures and fasteners - Part 6: Test methods for materials used in the production of electronic fasteners
TS EN 61191-3 Printed circuit units - Part 3: Part feature: Requirements for soldered units mounted along the hole (IRC 61191-3: 1998)
TS EN 61191-4 Printed circuit units - Part 4: Part feature: Requirements for the tip of soldered units (IRC 61191-4: 1998)
TS EN 61191-6 Printed circuit units - Part 6: Evaluation criteria and measurement method of clearances in soldered joints of bga and lga
TS EN 61249-4-11: Materials for 2005 printed circuits and other interconnection structures - Part 4-11: Part specification standard for sheathed prepreg materials - Non-halogenated epoxide wool e-Glass prepreg with defined flammability
TS EN 61249-4-5: Materials for 2005 printed circuits and other interconnection structures - Part 4-5: Part specification standard for sheathed prepreg materials - Flammable defined polyimide, modified or unmodified, woolen e-Glass prepreg
TS EN 61249-3-3 materials for printed circuits and other interconnection structures section 3-3: Part specifications for materials with and without reinforced base (designed for bendable printed circuits) )
TS EN 61249-3-4 materials for printed circuits and other interconnection structures section 3-4: Part specifications for materials with and without reinforced base (designed for bendable printed circuits) )
TS EN 61249-3-5 Materials for printed circuits and other interconnection structures - Part 3-5: Particular properties for reinforced base materials, coated and uncoated - (designed for bendable printed circuits) - Transfer adhesive films (ic 61249-3) -5: 1999)
TS EN 61249-7-1 Materials for interconnecting elements - Part 7: Part specification for holding core materials - Part 1: Copper / Inval / Copper
TS EN 61249-8-8 Materials used in interconnection structures -Chapter 8: Part property range for non-conductive films and coatings -Part 8: Temporary polymer coating
TS EN 61249-4-2: Materials for 2005 printed circuits and other interconnection structures - Part 4-2: Part specification standard for sheathless prepreg materials - Multifunctional epoxide wool e-Glass prepreg with defined flammability
TS EN 61249-2-1 Materials for printed circuits and other interconnection structures - Part 2-1: Uncoated and sheathed reinforced base materials - Phenolic cellulose paper, reinforced laminate sheets, economic grade, copper sheathed
TS EN 61249-2-2 Materials for printed circuits and other interconnection structures - Part 2-2: Part specification standard for reinforced base materials without sheathed and sheathed - Phenolic cellulose paper, reinforced laminate sheets, high electrical grade, copper sheathed
TS EN 61249-2-4 Materials for printed circuits and other interconnection structures - section 2-4: Base material reinforced, coated and uncoated - Flame retardant (vertical combustion test) polyester non-woven / woven fiberglass plates, copper coated
TS EN 61249-2-6 Materials for printed circuits and other interconnection structures - Part 2-6: Reinforced base materials without sheath and sheath - Flammability defined (vertical combustion test) brominant epoxide wool / woolen e-Glass reinforced laminate sheets, copper sheathed
TS EN 61249-2-8 Materials for printed circuits and other interconnection structures - Part 2-8: Reinforced base materials without sheath and sheathed - Modified brominant epoxide wool reinforced fiberglass reinforced laminated sheets with copper sheath
TS EN 61249-2-9 Materials and other interconnection structures for printed circuits - Part 2-9: Reinforced base materials without sheath and sheath - Flammability defined (vertical combustion test) bismalemide / triazine, modified epoxide or unmodified, woolen e-Glass reinforced laminate sheets, copper sheathed
TS EN 61249-4-12: Materials for 2005 printed circuits and other interconnection structures - Part 4-12: Part specification standard for sheathless prepreg materials - Non-halogen multifunctional epoxide wool e-Glass prepreg with defined flammability
TS EN 61249-4-1 Materials for printed circuits and other interconnection structures - Part 4-1: Part specification standard for uncoated, impregnated materials (for the production of multi-layered cards) - Resin impregnated e-Glass with epoxy fabric of defined flammability
TS EN 61249-2-12 Materials for printed circuits and other interconnection structures section 2-13: Part specifications for reinforced and uncoated base materials - Non-braided, copper-coated epoxy aramid sheet with defined flame resistance
TS EN 61249-2-13 Materials for printed circuits and other interconnection structures section 2-13: Part specification for materials with and without reinforced base
TS EN 61249-2-10 Materials and other interconnection structures for printed circuits - Part 2-10: Reinforced base materials without sheath and sheath - Flammability defined (vertical combustion test) cyanate ester, brominant epoxide, modified or unmodified, woolen Glass reinforced laminate sheets, copper sheathed
TS EN 61249-2-11 Materials and other interconnection structures for printed circuits - Part 2-11: Reinforced base materials without sheath and sheath - Flammability defined (vertical combustion test) polyimide, brominant epoxide modified or unmodified, woolen e-Glass reinforced or modified laminate leaves, copper sheathed
TS EN 61249-2-18 Materials for printed circuits and other interconnection structures - part 2-18: Base material reinforced, coated and uncoated - Flame retardant (vertical combustion test) polyester non-woven fiberglass reinforced sheet, copper-coated sheet
TS EN 61249-2-19 Materials for printed circuits and other interconnection structures - section 2-19: Base material reinforced, coated and uncoated - Flammability determined (vertical combustion test) cross-processed linear fiberglass reinforced plates with epoxy layer, copper coated
TS EN 61249-2-21 Materials for printed circuits and other interconnection structures - Part 2-21: Reinforced base materials without sheath and sheathed - Non-halogenated epoxide wool reinforced e-Glass reinforced laminate sheets, copper sheathed
TS EN 61249-2-22 Materials and other interconnection structures for printed circuits - Part 2-22: Reinforced base materials without sheath and sheath - Modified non-halogen epoxide wool e-Glass laminate sheets with copper sheath, defined as flammability (vertical combustion test)
TS EN 61249-2-23 Materials and other interconnection structures for printed circuits - Part 2-23: Reinforced base materials with and without sheath - Reinforced laminated sheets of non-halogen phenolic cellulose paper, economic grade, copper sheathed
TS EN 61249-2-26 Materials for printed circuits and other interconnection structures - Part 2-26: Reinforced base materials without sheath and sheath - Non-halogenated epoxide wool / woolen e-Glass reinforced laminate sheets with non-halogenated epoxide wool / wool sheathed
TS EN 61249-2-36 Materials for printed circuit boards and other interconnection structures - Part 2-36: Reinforced base materials, coated and uncoated - Flammability defined (vertical ignition test), epoxy fabric e-Glass sheets, for lead-free assembly copper plating
TS EN 61249-2-38 Materials for printed circuit boards and other interconnection structures - Part 2-38: Reinforced base materials, coated and uncoated - Halogenated, flammability-defined (vertical ignition test), epoxy fabric e-Glass sheet sheets, lead-free copper plating for fixings
TS EN 61249-2-41 Materials for printed circuit boards and other interconnection structures - Part 2-41: Reinforced base materials, coated and uncoated - Flammability defined (vertical ignition test), brominant epoxy cellulose paper / wool e-Glass sheet sheets , copper-plated for lead-free fittings
TS EN 61249-2-42 Materials for printed circuit boards and other interconnection structures - Part 2-41: Reinforced base materials, coated and uncoated - Flammability defined (vertical ignition test), brominant epoxy cellulose non-wool / wool e-Glass sheet sheets , copper-plated for lead-free fittings
TS EN 61249-4-14 Materials for printed circuit boards and other interconnection structures - Part 4-14: Part feature set for uncoated, impregnated materials (for the manufacture of multi-layer cards) - Epoxy defined flammability for lead-free devices (vertical ignition test) fabric impregnated e-Glass
TS EN 61249-4-17 Materials for printed circuit boards and other interconnection structures - Part 4-17: Part specification set for uncoated, impregnated materials (for the manufacture of multi-layer cards) - Flammability defined for lead-free devices (vertical ignition test) multifunction impregnated non-halogenated epoxy fabric e-Glass
TS EN 62137 Methods for measuring the power consumption of audio, video and related devices
TS EN 62326-4 Printed circuit boards - part 4: Rigid multi-layer printed circuit boards with intermediate layer connection - Part features
TS EN 62326-1 Printed circuits - Part 1: General specifications standard
TS EN 62326-4-1 Printed circuit boards - Part 4: Hard multi-layer printed circuit boards with interlayer - Part features - Part 1: Capability detail specifications - A, b and c performance levels
TS EN 123100 + A1 Part specifications - Single and double sided printed circuit boards with hollow holes
TS EN 123200 + A1 Part features - Single and double sided printed circuit boards with internal lining
TS EN 123300 + A1 Part features - Multilayer printed circuit boards
TS EN 123400 + A2 Part features, flexible printed circuit boards without direct connection
TS EN 123400-800 Qualification detail specifications - Flexible printed circuit boards without direct connection
TS EN 123500 + A2 Part features, flexible printed circuit boards without direct connection
TS EN 123500-800 Qualification detail specifications - Flexible printed circuit boards with direct connection
TS EN 123600 Part features - Flexible rigid multilayer printed circuit boards with transition connections
TS EN 123700 Part features - Flexible rigid double-sided printed circuit boards with transition connections
TS EN 123800 Part features - Flexible multi-layer printed circuit boards with transition connections